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Thermal pad GELID GP-Extreme, 12 W/mK, 80 × 40 × 0.5mm
Thermal pad GELID GP-Extreme, 12 W/mK, 80 × 40 × 0.5mm
Thermal pad GELID GP-Extreme, 12 W/mK, 80 × 40 × 0.5mm

Thermal pad GELID GP-Extreme, 12 W/mK, 80 × 40 × 0.5mm

14.74 €
12.18 € without VAT
For orders above 1,000 € you get FREE shipping
Details

GELID GP-Extreme thermal pad, 80 × 40 × 0.5 mm, with 12 W/mK thermal conductivity. Suitable for GPUs, graphics cards, motherboards, laptops and other electronic components requiring efficient heat transfer.

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Match code

NARAD-106

Artikel

1100341209

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Thermal pad GELID GP-Extreme, 12 W/mK, 80 × 40 × 0.5mm

14.74 €

  • GELID GP-Extreme Thermal Pad, 12 W/mK, 80 × 40 × 0.5 mm

    The GELID GP-Extreme thermal pad is designed to improve heat transfer between electronic components and cooling surfaces. It is suitable for use with GPUs, graphics cards, motherboards, laptops and other components where stable thermal contact is required.

    With a thermal conductivity of 12 W/mK, the pad helps transfer heat away from sensitive components and supports reliable cooling performance. It is especially useful for filling smaller gaps between heatsinks and components such as memory chips, VRMs, MOSFETs and other PCB components.

    The pad has a size of 80 × 40 × 0.5 mm and can be cut to the required dimensions. Thanks to its flexible silicone structure, it adapts well to contact surfaces and is easy to apply during repair, maintenance or PC assembly.

    Key features

    • GELID GP-Extreme thermal pad for electronics cooling
    • Thermal conductivity: 12 W/mK
    • Size: 80 × 40 × 0.5 mm
    • Suitable for GPU, graphics card, motherboard and laptop cooling
    • Helps fill smaller gaps between heatsinks and electronic components
    • Can be cut to the required size
    • Non-electrically conductive silicone material
    • Non-corrosive and non-curing design
    • Easy application during repair, maintenance or PC assembly

    Technical specifications

    • Product type: thermal pad
    • Model: GELID GP-Extreme
    • Material: silicone
    • Thermal conductivity: 12 W/mK
    • Size: 80 × 40 mm
    • Thickness: 0.5 mm
    • Density: 2.8 g/cm³
    • Hardness: 35 Shore
    • Electrical conductivity: non-electrically conductive
    • Application: GPU, graphics card, motherboard, laptop, VRM, memory chips and electronic components

    Application

    Before installation, clean the contact surface of the component and heatsink. Cut the thermal pad to the required size, remove the protective film and place it between the component and the cooling surface. Proper contact pressure is important for optimal heat transfer.

    Package contents

    • 1 × GELID GP-Extreme thermal pad, 80 × 40 × 0.5 mm

    This thermal conductive pad is a practical solution for servicing laptops, graphics cards, motherboards and other electronic devices where reliable heat dissipation is required.

  • Specification

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