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iFixes IC Underfill Glue - adhesive for IC chips on motherboard, 5ml
- Specialized adhesive for IC chips and motherboards
- Provides mechanical support and thermal stability
- Low viscosity for precise application
- Resistant to heat and vibration
- Suitable for smartphones, tablets, laptops and other devices
4.90 €Discount -80 %
0.97 €0.80 € without VATGet better prices up to -25%. Become a FixPartnerFor orders above 1,000 € you get FREE shippingDetailsHigh-performance underfill adhesive for securing IC chips on motherboards. Ensures strong bonding, thermal stability, and long-term reliability in electronic repairs.
Manufacturer
iFixesMatch code
NARD-83
Artikel
1100331910
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iFixes IC Underfill Glue - adhesive for IC chips on motherboard, 5ml
0.97 €
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iFixes iC9 Underfill Glue – 5 ml
iFixes iC9 Underfill Glue is a specialized adhesive designed for securing integrated circuit (IC) chips to motherboard surfaces. Ideal for microsoldering and advanced electronic repairs, this glue provides strong mechanical support and thermal stability, preventing chip detachment due to heat or vibration.
Its low-viscosity formula allows precise application under components, ensuring complete coverage and reliable bonding. Suitable for use in smartphones, tablets, laptops, and other compact electronic devices.
Technical specifications:
- Type: Underfill adhesive for IC chips
- Volume: 5 ml
- Color: Transparent
- Application: Microsoldering, motherboard repairs
- Features: Heat-resistant, vibration-resistant, long-lasting bond
Perfect for professional technicians and repair shops working on delicate motherboard components.
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Specification
Tool type
Category
Netto weight (kg)
0.015
Ean
2200000595645

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