Thermal pad RGEEK AC, 6.0 W/mK, 100 × 100 × 0.5mm

RGEEK AC Thermal Pad, 6.0 W/mK, 100 × 100 × 0.5 mm

The RGEEK AC thermal pad is designed to improve heat transfer between electronic components and cooling surfaces. It is suitable for use with CPUs, GPUs, laptops, graphics cards, memory chips, VRMs and other electronic components where stable cooling performance is required.

With a thermal conductivity of 6.0 W/mK, the pad helps transfer heat away from sensitive components and supports efficient heat dissipation. Its soft and flexible structure allows it to adapt to uneven contact surfaces and fill small gaps between the component and heatsink.

The pad has a size of 100 × 100 × 0.5 mm and can be cut to the required dimensions, making it suitable for repair work, PC assembly, laptop maintenance and general electronics servicing.

Key features

• RGEEK AC thermal pad for electronics cooling
• Thermal conductivity: 6.0 W/mK
• Size: 100 × 100 × 0.5 mm
• Suitable for CPU, GPU, laptop and graphics card cooling
• Helps fill gaps between heatsinks and electronic components
• Soft and flexible material for easier application
• Can be cut to the required size
• Suitable for repair, maintenance and PC assembly

Technical specifications

• Product type: thermal pad
• Model: RGEEK AC
• Thermal conductivity: 6.0 W/mK
• Size: 100 × 100 mm
• Thickness: 0.5 mm
• Operating temperature: -40 °C to 220 °C
• Hardness: 13C–50C
• Voltage proof: >4 kV
• Application: CPU, GPU, graphics card, laptop, VRM, memory chips and electronic components

Application

Before installation, clean the contact surface of the component and heatsink. Cut the thermal pad to the required size, remove the protective film and place it between the component and the cooling surface. Proper contact pressure is important for optimal heat transfer.

Package contents

• 1 × RGEEK AC thermal pad, 100 × 100 × 0.5 mm

This thermal conductive pad is a practical solution for servicing laptops, graphics cards, motherboards and other electronic devices where reliable heat dissipation is required.