Thermal paste GD900, 7g

GD900 Thermal Paste, 7 g

GD900 thermal paste is designed to improve heat transfer between electronic components and their cooling surfaces. It is suitable for use with CPUs, GPUs, LED components, MOS tubes and other electronic parts where efficient heat dissipation is required.

The paste helps fill microscopic gaps between the chip and heatsink, improving thermal contact and supporting more stable cooling performance. With a thermal conductivity of 4.8 W/mK, it is suitable for service work, computer maintenance and general electronics repair.

The 7 g syringe allows controlled application, while the included scraper helps spread the paste evenly over the required surface.

Key features

• GD900 thermal paste for electronics cooling
• Suitable for CPU, GPU, LED and electronic component cooling
• Thermal conductivity: 4.8 W/mK
• Helps improve heat transfer between component and heatsink
• Suitable for computer repair, maintenance and service work
• Easy application using syringe packaging
• Scraper included for even spreading

Technical specifications

• Product type: thermal conductive paste
• Model: GD900
• Net content: 7 g
• Thermal conductivity: 4.8 W/mK
• Density: 2.3 g/cm³
• Operating temperature: -50 °C to 200 °C
• Material: thermally conductive silicone grease
• Application: CPU, GPU, MOS tube, LED lamp and electronic components

Package contents

• 1 × GD900 thermal paste, 7 g
• 1 × scraper

This thermal conductive paste is a practical solution for improving heat dissipation during PC assembly, laptop maintenance, graphics card servicing and general electronic repairs.